SikaFast®-5215 NT

Fast curing, flexibilized, 2-component structural adhesive

SikaFast®-5215 NT is a fast curing, flexibilized structural, two-part adhesive system, which is based on Sika’s Acrylic Double Performance (ADP) polymer technology. Uncured SikaFast®-5215 NT is a pasty, non-sagging, hardly inflammable material which allows an easy and precise application.  

  • Strength development within minutes after application
  • Adhesion to a wide range of substrates without or with limited surface preparation
  • High strength and impact resistance
  • Solvent and acid free
  • Lower odor than products containing MMA
  • Easy mixing
 
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PRODUCT BENEFITS

  • Strength development within minutes after application
  • Adhesion to a wide range of substrates without or with limited surface preparation
  • High strength and impact resistance
  • Solvent and acid free
  • Lower odor than products containing MMA
  • Easy mixing
 

Areas of Application

SikaFast®-5215 NT is a fast curing, flexibilized structural adhesive designed to replace mechanical fixings such as rivets, screws or welding. It is suitable for high strength fastening of concealed joints and exhibits very good adhesion on different types of substrates including top coats, plastics, glass, wood, etc. This product is suitable for experienced professional users only. Tests with actual substrates and conditions have to be performed ensuring adhesion and material compatibility.  

Packaging

  

SikaFast®-5215 NT

Dual cartridge

50 ml

250 ml

SikaFast®-5215 NT (A)

Pails

20 l

169 l

SikaFast®-5200 (B)

Pail

18 l

 

Product Details

Typical Product Data
Properties

Component A

SikaFast®-5215 NT

Component B

SikaFast®-5200

Chemical base

Acrylate

Color (CQP001-1)

  

mixed

White

Black

Grey

Cure mechanism

Radical polimerization

Density (uncured)

  

mixed (calculated)

1.15 kg/l

1.5 kg/l

1.19 kg/l

Mixing ratio

by volume

by weight

10 : 1

10 : 1.3

Consistency

Thixotropic paste

Application temperature

5 ─ 40 °C

Open time (CQP526-2)

5 minutes A

Fixing time

time to reach 80 % of final strength

15 minutes A

Shore A hardness (CQP023-1 / ISO 7619-1)

90

Shore D hardness (CQP023-1 / ISO 7619-1)

50

Tensile strength (CQP036-1 / ISO 527)

10 MPa A

Elongation at break (CQP036-1 / ISO 527)

200 % A

E-Modulus (CQP036-1 / ISO 527)

250 MPa A

Tensile lap-shear strength (CQP046-6 / ISO 4587)

10 MPa A

Glass transition temperature (CQP509-1 / ISO 6721)

60 °C

Service temperature (CQP513-1)

-40 ─ 80 °C

Shelf life (CQP016-1)

cartridge 50 ml

cartridge other sizes

pail / drum

15 months B

9 months B

12 months B

9 months B

CQP = Corporate Quality Procedure

A) 23 °C / 50 % r. h.

B) stored below 25 °C and not exposed to direct sun light
Technical Information

CURE MECHANISM

SikaFast®-5215 NT cures according to radical chain polymerization. Open and fixture time are influenced by mixing ratio deviations as well as temperature, e.g., as higher the temperature as shorter the open and fixture time and vice versa. Adjustment of the bonded assembly is only possible within the open time.

CHEMICAL RESISTANCE

In the view of potential chemical or thermal exposure, it is required to conduct a project related testing.

Application

Application Information

Surface preparation

Surfaces must be clean, dry and free from grease, oil and dust. Remove all loose particles or residues by cleaning it thoroughly, for example with an IPA wipe. For best adhesion performance on non-porous substrates pre-treat the bonding area with Sika® ADPrep prior to the bonding process. Due to the diversity of materials, preliminary tests with original substrates are necessary.

Application

SikaFast®-5215 NT is applied with a mixing ratio of 10:1 by volume through a 24 elements static mixer. If applied in large masses, heat is generated by the exothermic reaction. To avoid excessive temperature increase, bond line thickness is limited to 3 mm, but must measure at least 0.5 mm. Optimum temperature for the bonding process is between 15 °C and 25 °C. The approved temperature range for substrates and adhesive is between 5 °C and 40 °C. The influence of the reactivity by temperature changes has to be respected.

 

After the open time has elapsed the bonded parts must not be moved against each other anymore. When the fixture time is reached the parts can be moved if no additional stress is distributed to the bond line. For support in evaluation of the appropriate application equipment contact the Sika System Engineering department of Sika Industry.

Removal

Uncured excess of SikaFast®-5215 NT can be removed easily before curing with a dry wipe, with Sika® Remover-208 or another suitable solvent. Once the adhesive is cured it can only be removed mechanically. Hands and exposed skin should be washed immediately using Sika® Cleaner-350H towels or a suitable industrial hand cleaner and water.

Do not use solvents on skin.