SikaMelt®-885 IA

(formerly SikaMelt®-9185 IA)

Reactive polyolefin hot melt for assembly applications

SikaMelt®-885 IA is a reactive hot melt adhesive based on polyolefin technology that cures on exposure to atmospheric humidity. Due to its chemical composition SikaMelt®-885 IA has a good and durable adhesion to polypropylene materials, but it can be also considered for certain polar substrates. SikaMelt®-885 IA has a short open time and fast strength buid-up after joining and is therefore mainly suitable for assembly applications. Because of its crossling with humidity SikaMelt®-885 IA withstands higher temperature loads compared to non-reactive polyolefin hot melts.  

  • Good adhesion on polypropylene and some polar substrates
  • High green strength
  • Very good water and heat resistance after moisture curing
 
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PRODUCT BENEFITS

  • Good adhesion on polypropylene and some polar substrates
  • High green strength
  • Very good water and heat resistance after moisture curing
 

Areas of Application

SikaMelt®-885 IA is especially designed for assembly applications of polypropylene materials. It is also suitable to bond on wood, textiles, non-woven materials and foams. Depending on the application requirements, polar plastics (ABS, PC and PA) can be joined as well. SikaMelt®-885 IA is mainly used where a combination of different materials needs be joined in combination with high temperature loads for the bonded parts.
This product is suitable for experienced professional users only. Tests with actual substrates and conditions have to be performed ensuring adhesion and material compatibility.  

Product Details

Typical Product Data
Chemical base

Polyolefin

Color (CQP001-1)

Yellow

Cure mechanism

Moisture curing

Density

0.9 kg/l

Viscosity (by Brookfield)

at 140 °C

10 000 mPa·s

Softening temperature (CQP538-5)

130 °C

Application temperature

 

short term max. 1 h

140 – 180 °C

190 °C A

Curing time (CQP558-1)

20 h

Green strength (CQP557-1)

1.1 MPa

Shore A hardness (CQP023-1 / ISO 48-4)

82

Shelf life

12 months

CQP = Corporate Quality Procedure

A) only valid for nozzle

Technical Information

CURE MECHANISM

SikaMelt®-885 IA cures by reaction with atmospheric moisture. At low temperatures the water content in the air is lower, which will result in a lower curing speed (see diagram 1).
When bonding hydrophobic (e.g. PP) and/or moisture impermeable substrates a significantly longer curing time has to be taken into account. This applies especially on assembly applications with an adhesive thickness > 100 µm. For lamination applications of hydrophobic and/or moisture impermeable substrates the adhesive layer shall not exceed 100 µm. In such cases project related tests with original substrates and conditions are mandatory.

en_PNG_01-diagram-sikamelt-885IA

Diagram 1: Curing time for a 500 µm film

CHEMICAL RESISTANCE

SikaMelt®-885 IA is resistant to aqueous surfactant, weak alkaline/ acids solutions and temporarily resistant to fuels, solvents and mineral oils.
The chemical resistance is influenced by several factors such as chemical composition, concentration, period of exposure and temperature. Therefore a project related testing in case of chemical or thermal exposure is required.

Application

Application Information

Surface preparation

Surfaces must be clean, dry and free from grease, oil and dust.

 

Application

With adequate processing equipment SikaMelt®-885 IA can be applied as film, dot, bead or spray application.
For automated appli­cations a suitable filter system is required.
To meet the required application properties the adhesive viscosity can be adjusted by adapting the application temperature (see table Typical Product Data).
During breaks SikaMelt®-885 IA is to be processed as follows:
For breaks ≥ 1 h the heating needs to be lowered to 80 °C and for breaks ≥ 4 h the heating needs to be switched off.
To ensure a constant quality during the whole production process it is mandatory to protect the adhesive in the melting tank with nitrogen, carbon dioxide or dried air (to avoid possible reaction of the product with humidity). At breaks or shut downs dip nozzle in dried oil in order to prevent curing the adhesive (avoid blockage).
For advice on selecting and setting up suitable processing equipment contact the System Engineering Department of Sika Industry.

Removal

Equipment and application tools can be cleaned with SikaMelt®-005 (see also Cleaning Instructions).
SikaMelt®-885 IA may be removed from tools and equipment with Sika® Remover-208 or another suitable solvent.
Hands and exposed skin have to be washed immediately using Sika® Cleaner-350H or a suitable industrial hand cleaner and water.

Do not use solvents on skin.

STORAGE CONDITIONS

SikaMelt®-885 IA has to be stored at temperature below 40 °C in a dry place.
For transportation purposes, the storage temperature can be exceeded for a period of max. 2 weeks up to 60 °C.