Sika® AcouBond® System
Impact sound reducing system for wood flooring
Adhesive system for laying parquet strips, composed of the system products Sika® Layer-03 and Sika® Layer Silent as well as SikaBond®-52 Parquet and SikaBond® AT-82 N.
- Impact sound reduction in accordance with EN ISO 10140 up to 15 dB (please note "Important Considerations")
- Low adhesive consumption
- Broad spectrum of uses
- Can be used without primer on many substrates
- Simple and secure gluing with pre-defined gluing grid
- Increased tread comfort
Areas of Application
- For gluing 3-ply parquet in strips and selected solid parquet to appropriate substrates (see processing instructions section)
- To improve the impact sound rating
Advantages
- Impact sound reduction in accordance with EN ISO 10140 up to 15 dB (please note "Important Considerations")
- Low adhesive consumption
- Broad spectrum of uses
- Can be used without primer on many substrates
- Simple and secure gluing with pre-defined gluing grid
- Increased tread comfort
System Details
SUSTAINABILITY
SikaBond®-52 Parquet
- EMICODE EC1PLUS, very low emissions
- LEED® EQc 4.1
SikaBond® AT-82 N
- EMICODE EC1PLUS, very low emissions
CERTIFICATES AND TEST REPORTS
Sika® AcouBond® system with SikaBond® AT-82 N and Sika® Layer Silent
EMPA, Dübendorf (CH): Impact sound measurement (impact sound insulation 14 dB) - test report no. 5214019884
Sika® AcouBond® system with SikaBond®-52 Parquet and Sika® Layer-03
EMPA, Dübendorf (CH): Footfall sound measurement (footfall sound insulation 15 dB) - test report no. 5214019884
Sika® AcouBond® system with Sika® Layer-03
Sound Transmission Class 60: RAL -TL01-222 USA Reduction of Impact Sound Lw 16 dB - Report 00A730e
Shelf life
Sika® Layer-03, Sika® Layer Silent: | Stored in dry conditions: Unlimited |
SikaBond®-52 Parquet, SikaBond® AT-82 N: | In unopened original packaging: 12 months from date of production |
Storage conditions
Storage temperature between +5 °C and +25 °C. Store cool and dry. Protect against direct sunlight and frost.
Composition
Sika® Layer-03: | PE foam |
Sika® Layer Silent: | Recycling foam |
SikaBond®-52 Parquet: | i-Cure™ polyurethane |
SikaBond® AT-82 N: | Silane-terminated polymer |
Application
SUBSTRATE PREPARATION
The substrate must be ready for laying, i.e. level, firm, clean, dry and dust-free. The requirements according to local standards apply.
Concrete, cement screed
Grind surface, e.g. with a single disc grinding machine, until the surface is firm and non-slip and clean thoroughly with an industrial vacuum cleaner.
Calcium sulphate screed, calcium sulphate self-levelling screed
Grind surface, e.g. with a single disc grinding machine, until the surface is firm and non-slip and clean thoroughly with an industrial vacuum cleaner shortly before applying adhesive.
Glazed ceramic tiles
Degrease with Sika® Aktivator-205 or grind surface and clean with an industrial vacuum cleaner.
Dry floor constructions, e.g. wood or plasterboard (chipboard, veneer)
For gluing solid parquet flooring, you need two floating layers of chipboard or OSB boards, offset, glued and screwed together (minimum layer thickness 25 mm). Floating dry floor constructions must have a minimum coating thickness of 22 mm. Otherwise screw or glue these constructions to the substrate so that they are firmly and securely seated.
Other substrates
Please contact Sika Technical Service.
Sika® AcouBond® System can be used without primer on (ready to install) cement screeds, calcium sulphate creeds, sanded mastic asphalt, chipboard V100, concrete and ceramic tiles.
Pre-treat cement screeds with high moisture content and substrates bearing traces of old adhesive with Sika® Primer MB, Sika® Primer MB Rapid or Sika® Primer MR Fast.
Cement-based substrates with excessive residual moisture and substrates with old adhesive residues should be pre-treated with Sika® Primer MB, Sika® Primer MB Rapid or Sika® Primer MR Fast.
For further information, consult corresponding product data sheet or contact the local Sika technical service.
APPLICATION
Lay Sika® Layer-03 and/or Sika® Layer Silent parallel to the parquet laying direction on the prepared surface. Ensure that the individual strips are pushed tight together but never overlapping.
Respectively an applicator gun for tubular bags or for cartridges is needed for use of the adhesive. Apply adhesive with manual, rechargeable or compressed-air gun into all designated mesh slots. Keep the application nozzle vertical to the substrate.
Important: Bead dimension must be 10 * 8 mm. Never apply adhesive to the mat between the slits.
Adjust parquet elements and then push into the adhesive until they are resting fully on the respective Sika® Layer Mat. The parquet elements can then be tapped with a hammer and block until they are laid tightly together.
The distance to the wall must be at least 1 - 2 cm depending on type of parquet and room size.
The laying instructions of the wood manufacturer must be taken into consideration.
Limits
Sika® AcouBond® System is ideal for gluing 3-ply parquet and selected, non-swelling solid parquet, e.g. Oak, Douglas fir, Merbau, Jatoba, Iroko, Elm or Wenge, in the following dimensions:
3-ply parquet (Tongue and groove join) | (DIN EN 14389) |
Length: | ≥ 300 mm |
Width: | ≥ 50 mm |
Thickness: | ≥ 12 - 28 mm |
Strip parquet, parquet strip (Tongue and groove join) | (DIN EN 13226) |
Length: | ≥ 300 mm |
Width: | Width/thickness ratio: max. 4:1 |
Thickness: | ≥ 15 mm |
Solid boards
Length: | ≤ 2 400 mm |
Width: | ≤ 180 mm (width/thickness ratio: max. 8:1) |
Thickness: | 15 - 22.5 mm |
CLEANING OF EQUIPMENT
Clean application equipment immediately after use with Sika® Remover-208. Once cured, material can only be removed mechanically.
For cleaning skin, use Sika® Cleaning Wipes-100.
If the parquet surface is soiled before the application, check its compatibility.