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SikaBiresin® CR131 CB

Composite resin system with increased electrical conductivity and Tg up to 133 °C

SikaBiresin® CR131 CB is a modified epoxy resin system with high electrical conductivity. It is designed to prevent electrostatical charge on composite parts.  

  • Increased electrical conductivity
  • Very good mechanical properties
  • Optimized properties for use in filament winding
 
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PRODUCT BENEFITS

  • Increased electrical conductivity
  • Very good mechanical properties
  • Optimized properties for use in filament winding
 

Areas of Application

SikaBiresin® CR131 CB is especially suited to the filament winding process and the production of composite parts with higher electrical conductivity.
This product is suitable for experienced professional users only. Tests under actual processing conditions and with additional materials such as fibers and release agents must be performed to proof material compatibility.  

Packaging

  

SikaBiresin® CR131 CB (A)

Hobbock

25 kg

Drum200 kg

SikaBiresin® CH135-8 (B)

Can

2.1 kg

Drum180 kg
IBC850 kg

 

Product Details

Typical Product Data
Properties

Component A

SikaBiresin® CR131 CB

Component B

SikaBiresin® CH135-8

Chemical base

Epoxy resin

Amine hardener

Color

Black

Transparent

Density

  

cured

1.16 kg/l

0.94 kg/l

1.17 kg/l

Mixing ratio

by weight

by volume

100 : 20

100 : 25

Viscosity (CQP029-4)

  

mixed

3700 mPa·s

10 mPa·s

850 mPa·s

Application temperature

product

18 – 25 °C

Pot life (CQP021-3 / Gel Timer TECAM)

215 minutes

Curing conditions

2.5 hours

150 °C

Tensile strength (CQP036-2 / ISO 527)

70 MPa

Tensile modulus (CQP036-2 / ISO 527)

2700 MPa

Tensile elongation (CQP036-2 / ISO 527)

3.0 %

Flexural strength (CQP027-2 / ISO 178)

130 MPa

Flexural modulus (CQP027-2 / ISO 178)

2900 MPa

Compressive strength (CQP028-5 / ISO 604)

115 MPa

Shore D hardness (CQP023-1 / ISO 868)

86

Impact resistance (CQP038-2 / ISO 179)

30 kJ/m2

Glass transition temperature (CQP301-5 / ISO 11357)

133 °C

Heat deflection temperature (CQP030-1 / ISO 75A)

120 °C

Shelf life

12 months

CQP = Corporate Quality Procedure

Application

Application Information

Application

The resin system is optimized for processing temperatures between 18 °C – 25 °C. Consider the change in processing parameters if the resin system is processed at different temperatures. The curing must be performed at temperature ≥ 18 °C.
Prior to application, check both components for crystallization. The crystallization process can be reversed by heating the product to 60 °C – 70 °C until the crystals are no longer visible.
Containers must be closed tightly immediately after each use to prevent moisture ingress.

Removal

Uncured SikaBiresin® CR131 CB can be removed from tools and equipment with Sika® Reinigungsmittel 5 or another suitable solvent. Once cured, the material can only be removed mechanically. Hands and exposed skin shall be washed immediately using industrial hand cleaner and water.
Do not use solvents on skin.

STORAGE CONDITIONS

All components must be stored between 15 °C – 30 °C.
Prior to use check the material for homogeneity and crystallization and make sure to temper it to processing temperature.

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