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SikaBiresin® CR172

Composite resin system for hand lay-up process with Tg up to 174 °C

SikaBiresin® CR172 is an epoxy resin system designed for the hand lay-up process suitable for applications where a very high thermal resistance of up to 174 °C is needed.  

  • Good impregnation of dry fabrics and non-draining properties
  • Suitable for hand lay-up process and vacuum infusion (only at elevated temperature of approx. 40 °C)
  • Tg up to 174 °C
 
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PRODUCT BENEFITS

  • Good impregnation of dry fabrics and non-draining properties
  • Suitable for hand lay-up process and vacuum infusion (only at elevated temperature of approx. 40 °C)
  • Tg up to 174 °C
 

Areas of Application

SikaBiresin® CR172 is especially suited to the hand lay-up process and can be used in many areas including high temperature composites moldmaking and for the production of general industrial composites components. This product is suitable for experienced professional users only. Tests under actual processing conditions and with additional materials such as fibers and release agents must be performed to proof material compatibility.  

Product Details

Typical Product Data
Properties

Component A
SikaBiresin® CR172

Component B
SikaBiresin® CH172-6

Chemical base

Epoxy resin

Amine hardener

Color

Translucent

Colorless to brownish

Density

 

cured

1.16 kg/l

0.94 kg/l

1.17 kg/l

Mixing ratio

by weight

by volume

100 : 19

100 : 24

Viscosity (CQP029-4)

 

mixed

6000 mPa·s

10 mPa·s

800 mPa·s

Pot life (CQP021-3 / Gel Timer TECAM)

220 minutes

Curing conditions

8 hours

160 °C

Tensile strength (CQP036-2 / ISO 527)

76 MPa

Tensile modulus (CQP036-2 / ISO 527)

2750 MPa

Tensile elongation (CQP036-2 / ISO 527)

3.9 %

Flexural strength (CQP027-2 / ISO 178)

130 MPa

Flexural modulus (CQP027-2 / ISO 178)

2950 MPa

Compressive strength (CQP028-5 / ISO 604)

140 MPa

Shore D hardness (CQP023-1 / ISO 868)

82

Impact resistance (CQP038-2 / ISO 179)

26 kJ/m²

Glass transition temperature by DMA (CQP301-4 / ISO 6721)

174 °C

Heat deflection temperature (CQP030-1 / ISO 75A)

165 °C

Heat deflection temperature (CQP030-1 / ISO 75B)

170 °C

Shelf life

24 months

12 months

CQP = Corporate Quality Procedure

Application

Application Information

Application

The resin system is optimized for processing temperatures between 18 °C – 25 °C. Consider the change in processing parameters if the resin system is processed at different temperatures. The curing must be performed at temperature ≥ 18 °C.
Prior to application, check both components for crystallization. The crystallization process can be reversed by heating the product to 60 °C – 70 °C until the crystals are no longer visible.
Containers must be closed tightly immediately after each use to prevent moisture ingress.

Removal

Uncured SikaBiresin® CR172 can be removed from tools and equipment with Sika® Reinigungsmittel 5 or another suitable solvent. Once cured, the material can only be removed mechanically. Hands and exposed skin shall be washed immediately using industrial hand cleaner and water.
Do not use solvents on skin.

STORAGE CONDITIONS

All components must be stored between 15 °C – 30 °C.

Prior to use check the material for homogeneity and crystallization and make sure to temper it to processing temperature.