SikaPower®-829 AP
SikaPower®-829 AP is a toughened, high strength, solvent free, thixotropic epoxy adhesive.
It shows very good adhesion on fiberreinforced composites and has been designed for the bonding of wind turbine blades.
- Good fatigue properties
- High resistance against crack initiation and propagation
- Low density
- Long open time at high temperature and humidity
- Fast curing at moderate temperature
- Low exothermic peak temperature
- Good non sag properties
PRODUCT BENEFITS
- Good fatigue properties
- High resistance against crack initiation and propagation
- Low density
- Long open time at high temperature and humidity
- Fast curing at moderate temperature
- Low exothermic peak temperature
- Good non sag properties
Areas of Application
SikaPower®-829 AP is used for bonding highly stressed components in the manufacturing process of wind turbine rotor blades (shells, shear webs, etc.).This product is suitable for professional experienced users only. Tests with actual substrates and conditions have to be performed ensuring adhesion and material compatibility.
Packaging
SikaPower®-829 AP
| Drum | 220 kg |
SikaPower®-051 AP
| Drum | 220 kg |
Product Details
| Properties |
| ||||
| Chemical base |
| ||||
| Color (CQP001-1) |
mixed |
| |||
| Density |
mixed (calculated) |
| |||
| Mixing ratio | by volume by weight | 100 : 47 100 : 47 | |||
| Viscosity (CQP029-4) | 25 mm PP, d = 1 mm, 10 s-1 |
| |||
| Consistency | Thixotropic paste | ||||
| Application temperature | 15 ─ 30 °C | ||||
| Open time (CQP046-11 / ISO 4587) | 120 minutes B, C | ||||
| Curing time (CQP046-9, ISO4587) | at 70 °C | 4 hours | |||
| Tensile strength (CQP543-1 / ISO 527) | 45 MPa A, D | ||||
| E-Modulus (CQP543-1 / ISO 527) | 3000 MPa A, D | ||||
| Elongation at break (CQP543-1 / ISO 527) | 3 % A, D | ||||
| Tensile lap-shear strength (CQP046-9 / ISO 4587) | 25 MPa A, C | ||||
| Critical stress intensity factor KIc (ISO 13586) | 3.5 MPa∙m1/2 A, E | ||||
| Critical energy release rate GIc (ISO 13586) | 4.0 N/mm A, E | ||||
| Glass transition temperature (CQP509-1 / ISO 6721) | 90 °C | ||||
| Shelf life | 12 months F |
| CQP = Corporate Quality Procedure | A) 23 °C / 50 % r. h. | B) 28 °C / 70 % r. h. | C) adhesive layer: 25 x 12.5 x 3 mm / on GRE |
| D) tested at 2 mm/min | E) CT-specimen (Optical Crack Tracking) | F) stored between 10 and 30 °C |
CURE MECHANISM
SikaPower®-829 AP cures by chemical reaction of the two components at room temperature. The cure rate is accelerated at higher temperature.
The final glass transition temperature, as well as the tensile and shear strengths, may be increased with higher curing temperature.
CHEMICAL RESISTANCE
In case of chemical or thermal exposure, we recommend a project related testing. Please consult our Technical Service Department of Sika Industry for advice.
Application
Surface preparation
SikaPower®-829 AP adheres usually well on fresh epoxy composites without additional pretreatment, if applied subsequently after the removal of the protecting peel ply.
Surfaces must be clean, dry and free from grease, oil and dust. Surface treatment depends on the specific nature of the substrates and is crucial for a long lasting bond. All pre-treatment steps must be confirmed by preliminary tests on original substrates considering specific conditions in the assembly process.
Application
SikaPower®-829 AP is applied out of drums with automatic application equipments.
For advice on selecting and setting up a suitable pump system, contact the System Engineering Department of Sika Industry.
Removal
Uncured SikaPower®-829 AP may be removed from tools and equipment with Sika® Remover-208 or another suitable solvent. Once cured, the material can only be removed mechanically.
Hands and exposed skin have to be washed immediately using hand wipes such as Sika® Cleaner-350H or a suitable industrial hand cleaner and water.
Do not use solvents on skin.