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SikaFast®-300 L04

Multipurpose methacrylate adhesive

SikaFast®-300 L04 is an methyl methacrylate based, fast curing, flexibilized structural, 2-component adhesive. The Product is for use in applications requiring quick fixturing for higher throughput. It is designed to efficiently transfer high loads and evenly distribute stresses. SikaFast®-300 L04 provides very good adhesion on various substrates and is suitable to replace mechanical fixation.  

  • Strength development within minutes after application
  • Non-sagging thus suitable for vertical applications and filling of irregular joints
  • Adhesion to a wide range of substrates without or with limited surface preparation
  • Very good mechanical properties at low temperatures
  • High resistance to dynamic loads (vibrations and impacts) and to ageing
 
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PRODUCT BENEFITS

  • Strength development within minutes after application
  • Non-sagging thus suitable for vertical applications and filling of irregular joints
  • Adhesion to a wide range of substrates without or with limited surface preparation
  • Very good mechanical properties at low temperatures
  • High resistance to dynamic loads (vibrations and impacts) and to ageing
 

Areas of Application

SikaFast®-300 L04 is designed for fast bonding of a variety of substrates, including composites, thermoplastics and metals in general industry. This product is suitable for experienced professional users only. Tests with actual substrates and conditions have to be performed ensuring adhesion and material compatibility.  

Packaging

  

SikaFast®-300 L04 (A+B)

Dual cartridge

50 ml

400 ml

ul(50 ml)

Mixer: Sulzer Mixpac™ MBQ 05-24L (50 ml)

Mixer: Sulzer Mixpac™ MFQ 08-24T (400ml)

SikaFast®-300 L04 (A)

Pail

18 kg

SikaFast®-300 (B)

Pail

18 kg

 

Product Details

Typical Product Data
Properties

SikaFast®-300 L04 (A)

SikaFast®-300 L04 (B)

Chemical base

Methyl methacrylate

Color (CQP001-1)

Off-white

Off-white

Cure mechanism

Radical polymerization

Density

1.0 kg/l

1.0 kg/l

Mixing ratio

by volume / weight

100 : 100

Viscosity (CQP538-2)

at 24 °C

50 Pa·s

30 Pa·s

Application temperature

ambient, product and substrate

18 – 25 °C

Open time (CQP046-11 / ISO 4587)

4 minutes A

Handling time (CQP046-11 / ISO 4587)

20 minutes A

Tensile strength (ASTM D638)

22 MPa A, B

Elongation at break (ASTM D638)

25 % A, B

E-Modulus (ASTM D638)

1200 MPa A, B

Tensile lap-shear strength (CQP046-6 / ISO 4587)

19 MPa A, B, C

Service temperature (CQP513-2)

-40 ─ 120 °C

Shelf life

9 months

CQP = Corporate Quality Procedure

A) 23° C / 50 % r.h.

B) cured for 1 day at 23 °C

C) Adhesive layer: 25 x 12.5 x 0.3 mm
Technical Information

CURE MECHANISM

SikaFast®-300 L04 cures according to radical chain polymerization.

For an ideal curing process, it is required to homogeneously mix both components with the defined ratio.

Open and cure time are influenced by mixing ratio deviations as well as temperature. The higher the temperature the shorter the open and cure time and vice versa.
Despite the quick strength build-up, exposure to premature stresses must be avoided since this may result in a reduction of mechanical properties and loss of adhesion.

CHEMICAL RESISTANCE

In the view of potential chemical or thermal exposure, it is required to conduct project related testing.

Application

Application Information

Surface preparation

Surfaces must be clean, dry and free from grease, oil and dust. Remove all loose particles or residues by cleaning it thoroughly.
Due to the diversity of materials, preliminary tests with original substrates are necessary.

Application

SikaFast®-300 L04 is applied with a mixing ratio of 1:1 by volume from cartridges or bulk packaging. If applied in large masses, heat is generated by the exothermic reaction. To avoid excessive temperature increase, bond thickness is limited to 3 mm, but must measure at least 0.3 mm.

Optimum temperature for the bonding process (ambient, product and substrate) is between 18 °C and 25 °C. The influence of the reactivity by temperature changes must be respected.
The parts must always be joined within the open time.

SikaFast®-300 L04 shall be processed with pneumatic or electric driven piston guns as well as pump equipment.

 

For advice on selecting and setting up a suitable pump system, contact the System Engineering Department of Sika Industry.

Removal

Uncured excess of SikaFast®-300 L04 can be removed easily before curing with a dry wipe, with Sika® Remover-208 or another suitable solvent. Once the adhesive is cured it can only be removed mechanically.
Hands and exposed skin have to be washed immediately using hand wipes such as Sika® Cleaner-350H or a suitable industrial hand cleaner and water.
Do not use solvents on skin.

STORAGE CONDITIONS

All components of SikaFast®-300 L04 have to be stored at temperature between 5 °C and 23 °C in a dry place.

Do not expose it to direct sunlight or frost.

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