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SikaBiresin® RG51 HS RG530

Low pressure RIM system with very high impact resistance – simulation of PE / PP

SikaBiresin® RG51 HS RG530 is a very fast 2-component polyurethane low pressure RIM system for manufacturing of shock-resistant parts. The Product must be processed with an adequate equipment.  

  • Simulation of PE / PP
  • Very high impact resistance
  • High abrasion resistance
  • Short demolding time
  • Good flow behavior
 
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PRODUCT BENEFITS

  • Simulation of PE / PP
  • Very high impact resistance
  • High abrasion resistance
  • Short demolding time
  • Good flow behavior
 

Areas of Application

SikaBiresin® RG51 HS RG530 is designed for manufacturing of robust housings and coverings for electronical devices, portable tools and machine components, shock absorbers in construction and mining environment and cladding for parts which are subjected to high mechanical stress. This product is suitable for experienced professional users only.  

Packaging

   

SikaBiresin® RG51 HS (A)

Hobbock

20 kg

SikaBiresin® RG530 (B)

Bottle

0.975 kg

Canister

10 kg

20 kg

Drum200 kg
 

Product Details

Typical Product Data
Properties

Component A

SikaBiresin® RG51 HS

Component B

SikaBiresin® RG530

Chemical base

Polyol

MDI-based isocyanate

Color

  

  

mixed

Yellowish-transparent, black

Amber

Yellowish-transparent, black

Density

 

cured

1.05 kg/l

1.23 kg/l

1.15 kg/l 

Mixing ratio

by weight

by volume

100 : 50

100 : 43

Viscosity (CQP029-4)

1300 mPa·s

175 mPa·s

Pot life (CQP021-4)

at 23 °C

60 seconds

Demolding time

20 minutes A

Curing time

at 23 °C

3 days

Shore D hardness (CQP023-1 / ISO 868)

65 A, B

Tensile strength (CQP036-2 / ISO 527)

25 MPa A, B

Tensile elongation (CQP036-2 / ISO 527)

150 % A, B

Tear strength (CQP045-1 / ISO 34)

120 N/mm A, B

Flexural strength (CQP027-2 / ISO 178)

20 MPa A, B

Flexural modulus (CQP027-2 / ISO 178)

450 MPa A, B

Impact resistance (CQP038-2 / ISO 179)

eB

75 kJ/m2 A, B

Abrasion resistance (CQP112-1 / ISO 4649)

160 mm3 A, B

Heat deflection temperature (CQP030-1 / ISO 75B)

65 °C A, B

Shelf life

12 months

CQP = Corporate Quality Procedure

A) 60 °C mold temperature

B) curing condition: after demolding 7 days at 23 °C

Application

Application Information

Surface preparation

Surfaces must be clean, dry, and free from grease, oil and dust.
It is recommended to use wax-based release agents. For further information regarding Sika release agent consult the corresponding Product Data Sheet.

Application

The material and processing temperature for component A is 30 °C, to avoid a brittle phase at short demolding time.
The mold temperature shall be 60 °C.
SikaBiresin® RG51 HS RG530 is processed using 2-component low-pressure equipment. These equipment must be specifically set up for processing the parts to be manufactured.

 

The mixing process is performed by dynamic or static-dynamic mixing units.
The mold temperature has a significant influence on the mechanical and thermal properties of the final part. In case of lower mold temperature those properties may be improved by a post curing process.
Depending on the geometry and weight of the part, it is recommended to use a conformer while post curing.

STORAGE CONDITIONS

Both components must be stored at temperature between 15 °C and 25 °C in original unopened containers.