SikaPower®-751 T

Low sagging 2-component structural adhesive for panel bonding

SikaPower®-751 T is a non-filled and low sagging 2-component epoxy adhesive that cures at room temperature. It is suitable for bonding panels, including honeycomb, aluminium sheets, steel sheets, wood, composites, thermoplatics and foams.   

  • Long open time to cover and bond wide surfaces
  • Good mechanical and thermal properties
  • High impact resistance
  • High resistance to ageing and aggressive environments
  • Low sagging with hot curing process
 
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Overview

PRODUCT BENEFITS

  • Long open time to cover and bond wide surfaces
  • Good mechanical and thermal properties
  • High impact resistance
  • High resistance to ageing and aggressive environments
  • Low sagging with hot curing process
 

Areas of Application

SikaPower®-751 T is designed for bonding of large parts in transportation and general industry.
This product is suitable for experienced professional users only. Tests with actual substrates and conditions have to be performed ensuring adhesion and material compatibility.  

Packaging

   

SikaPower®-751 T (A)

Pail

25 kg

Drum210 kg

SikaPower®-751 T (B)

Pail

15.5 kg

Drum190 kg
 

Product Details

Properties

SikaPower®-751 T (A)

SikaPower®-751 T (B)

Chemical base

Epoxy

Amine

Color (CQP001-1)

 

mixed

White

Red

Translucent pink

Density

 

mixed (calculated)

1.16 kg/l

1.00 kg/l

1.08 kg/l

Mixing ratio

by volume

by weight

100 : 73

100 : 62

Viscosity (CQP538-2)

at 25 °C, spindle 4, speed 12 

at 25 °C, spindle 4, speed 30 

23 Pa·s

  

10 Pa·s

Consistency

Low-sagging

Application temperature

15 – 35 °C

Open time (CQP046-11 / ISO 4587)

40 minutes A, B

Handling time (CQP046-11 / ISO 4587)

6 hours A, B

Shore D hardness (CQP023-1 / ISO 868)

75 C

Tensile strength (CQP543-1 / ISO 527)

30 MPa A, C, D

E-Modulus (CQP543-1 / ISO 527)

1300 MPa A, C, D

Elongation at break (CQP543-1 / ISO 527)

10 % A, C, D

Tensile lap-shear strength (CQP046-9 / ISO 4587)

19 MPa A, B, C

Service temperature

-40 – 100 °C

Shelf life

12 months 

CQP = Corporate Quality Procedure

A) 23 °C / 50 % r.h.

B) adhesive layer: 25 x 12.5 x 0.3 mm / on aluminium

C) cured for 16 hours at 70 °CD) specimen type 1A acc. to ISO 527

CURE MECHANISM

SikaPower®-751 T cures by chemical reaction of the two components at room temperature. The cure rate is accelerated at higher temperatures, e.g. using ovens or infrared lamps. Final mechanical properties may be increased with higher curing temperature.

CHEMICAL RESISTANCE

In view of potential chemical or thermal exposure, it is required to conduct a project related testing.

Application

Surface preparation

Surfaces must be clean, dry and free from grease, oil and dust. Surface treatment depends on the specific nature of the substrates and is crucial for a long lasting bond. All pre-treatment steps must be confirmed by preliminary tests on original substrates considering specific conditions in the assembly process.

Application

The components must be mixed homogeneously with an adequate mixing equipment. To get full performance, the indicated mixing ratio must  be respected precisely.
The temperature of the mixture has a direct influence on the viscosity and pot life of the adhesive system.
For advice on selecting and setting up a suitable pump system, contact the System Engineering Department of Sika Industry.

Removal

Uncured SikaPower®-751 T may be removed from tools and equipment with Sika® Remover-208 or another suitable solvent. Once cured, the material can only be removed mechanically.

 

Hands and exposed skin have to be washed immediately using hand wipes such as Sika® Cleaner-350H or a suitable industrial hand cleaner and water.
Do not use solvents on skin.

STORAGE CONDITIONS

SikaPower®-751 T has to be kept between 15 °C and 25 °C in a dry place. Do not expose it to direct sunlight or frost.

After opening of the packaging, the contents have to be protected against humidity.

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