- High tack
- High peel strength
- Low viscosity
Areas of ApplicationSikaMelt®-211 is suitable to equip paper-, polymer- and metal foils, textiles, foams and a big variety of other materials with self-adhesive backsides. SikaMelt®-211 is not to be used on substrates containing monomeric plasticizer.
This product is suitable for experienced professional users only. Tests with actual substrates and conditions have to be performed ensuring adhesion and material compatibility.
|Viscosity (by Brookfield)|
at 150 °C
9 500 mPa∙s
|Softening temperature (CQP538-5)|
short term max. 1 hour
140 – 170 °C
200 °C A
|Peel strength (CQP568-1)|
35 N/25 mm B
CQP = Corporate Quality Procedure
A) only valid for nozzle
B) 23 °C / 50 % r. h.
SikaMelt®-211 is a physically hardening adhesive.
SikaMelt®-211 is resistant to aqueous surfactant, weak acids and caustic solutions.
The chemical resistance is influenced by several factors such as chemical composition, concentration, period of exposure and temperature. Therefore a project related testing in case of chemical or thermal exposure is required.
Surfaces must be clean, dry and free from grease, oil and dust.
Based on the surface and type of material, a physical or chemical pre-treatment might be required. Type of pre-treatment must be determined by preliminary tests.
With adequate processing equipment SikaMelt®-211 can be applied directly or by transfer method. It can be applied as film, dot, bead or spray application. For automated applications a suitable filter system is required.
Due to the better adhesion performance the direct method is usually chosen whenever possible. The transfer method is often used in combination with substrates that are porous and absorbing such as foams or when they are sensitive to high temperature such as thin PE films. To protect the adhesive surface against dust, light and oxygen it is necessary to cover the adhesive film with silicone coated paper or foil.
To meet the required application properties the adhesive viscosity can be adjusted by adapting the application temperature (see diagram 1).
Diagram 1: Viscosity as function of temperature
During breaks SikaMelt®-211 is to be processed as follows:
For breaks ≥ 1 h the heating needs to be lowered to 80 °C and for breaks ≥ 4 h the heating needs to be switched off.
To ensure a constant quality during the whole production process it is recommended to protect the adhesive in the melting tank with nitrogen or carbon dioxide (to avoid possible reaction of the product with oxygen).
For advice on selecting and setting up suitable processing equipment contact the System Engineering Department of Sika Industry.
SikaMelt®-211 may be removed from tools and equipment with Sika® Remover-208 or another suitable solvent.
Hands and exposed skin have to be washed immediately using hand wipes such as Sika® Cleaner-350H or a suitable industrial hand cleaner and water.
Do not use solvents on skin.
SikaMelt®-211 has to be stored at temperature below 40 °C in a dry place.
For transportation purposes, the storage temperature can be exceeded for a period of max. 4 weeks up to 60 °C.