SikaForce®-110 CT14
SikaForce®-110 CT14 is a foaming, moisture curing 1-component polyurethane adhesive for bonding sandwich panels and similar constructions of various materials. SikaForce®-110 CT14 is tested according to FTP Code system and approved according to the IMO Marine Equipment Directives.
- Short press time
- Low content of isocyanate
- IMO approved
PRODUCT BENEFITS
- Short press time
- Low content of isocyanate
- IMO approved
Areas of Application
SikaForce®-110 CT14 is used primarily for bonding sandwich panels with skin materials of pre-treated or primed aluminum, steel, glass fiber reinforced plastic and core materials of plywood, wood, extruded / expanded polystyrene and mineral wool. SikaForce®-110 CT14 is well suited for automatic applications. This product is suitable for experienced professional users only. Tests with actual substrates and conditions have to be performed, ensuring adhesion and material compatibility.Product Details
| Chemical base | Polyurethane | |
| Color (CQP001-1) | Yellowish | |
| Cure mechanism | Moisture curing | |
| Density (uncured) | 1.38 g/cm3 | |
| Consistency | Liquid | |
| Solid content | 100 % | |
| Viscosity (CQP029-4) | Rheometer, PP25, shear rate 10 s-1, d=1 mm | 13 500 mPa∙s A |
| Application temperature | 15 – 30 °C | |
| Open time (CQP097-1) | 6 minutes A | |
| Press time (CQP097-1) | 18 minutes A | |
| Gross calorific potential (EN ISO 1716) | 20.5 MJ/kg | |
| Shelf life | IBC smaller packaging | 3 months 6 months |
| CQP = Corporate Quality Procedure | A) 23 °C / 50 % r.h. |
CURE MECHANISM
The curing of SikaForce®-110 CT14 takes place by chemical reaction between the adhesive and moisture. Higher temperatures speed up the curing process and lower slow it down.
CHEMICAL RESISTANCE
In case of chemical or thermal exposure, conduct project related testing.
Application
Surface preparation
Surfaces must be clean, dry and free from grease, oil, dust and contaminants. After the cleaning process, a physical or chemical pre-treatment might be required, depending on surface and type of material. The type of pre-treatment must be determined by tests.
During the curing process, carbon dioxide is released from the adhesive. If none of the substrates are porous, measures need to be taken to allow the carbon dioxide to escape.
Application
Typically a coat weight between 100 g/m2 and 300 g/m2 is applied, depending on the substrates to be bonded. The specific coat weight for a given substrate combination must be determined by tests.
SikaForce®-110 CT14 is a moisture curing adhesive. A water mist of approx. 10 % of the adhesive coat weight, sprayed either on the adhesive or the bond face, is required.
To prevent curing of the product in the short term, the dosage nozzles for 1-component polyurethane adhesive are typically submerged in a tray filled with SikaForce®-097 Nozzle Oil, when not in use.
For manual application, apply with trowel, spray water mist on the surface and press parts together before the end of the open time.
For advice on selecting and setting up a suitable pump system, contact the System Engineering Department of Sika Industry.
Pressing
An adequate bonding pressure is necessary to obtain a voidless contact between the substrates and the adhesive. The specific pressure is, however, dependent on the core material and must be determined by tests. The pressure must always be below the maximum compressive strength of the core. After starting the press process, do not release the pressure until the press time has elapsed.
Removal
Uncured SikaForce®-110 CT14 may be removed from tools and equipment with SikaForce®-096 Cleaner. Once cured, the material can only be removed mechanically.
Hands and exposed skin have to be washed immediately using hand wipes such as Sika® Cleaner-350H or a suitable industrial hand cleaner and water.
Do not use solvents on skin.
STORAGE CONDITIONS
SikaForce®-110 CT14 has to be kept between 10 °C and 30 °C in a dry place. Do not expose it to direct sunlight or frost. After opening of the packaging, the content has to be protected against humidity.