Sikasil® AS-165
Industrial silicone adhesive
Sikasil® AS-165 is a 1-component, non-corrosive silicone adhesive. It adheres very well to common substrates in the photovoltaic industry.
- Good mechanical properties
- Good adhesion to a wide variety of substrates
- Performance retention over a wide temperature range
- Long-term durability
- UL certified: UL94 HB
PRODUCT BENEFITS
- Good mechanical properties
- Good adhesion to a wide variety of substrates
- Performance retention over a wide temperature range
- Long-term durability
- UL certified: UL94 HB
Areas of Application
Sikasil® AS-165 can be used for demanding industrial bonding and sealing applications. It is especially suited for frame and junction box bonding in the photovoltaic industry.Common substrates are metals, particularly aluminum, glass, metal primers and paint coatings (2-C systems), ceramic materials, plastics and wood. This product is suitable for experienced professional users only. Tests with actual substrates and conditions have to be performed ensuring adhesion and material compatibility.
Product Details
| Chemical base | 1-component silicone | |
| Color (CQP001-1) | White | |
| Cure mechanism | Moisture-curing | |
| Cure type | Oxime | |
| Density (uncured) | 1.44 kg/l | |
| Non-sag properties (CQP061-4 / ISO 7390) | Good | |
| Application temperature | ambient | 5 – 40 °C |
| Skin time (CQP019-1) | 8 minutes A | |
| Curing speed (CQP049-1) | (see diagram) | |
| Shore A hardness (CQP023-1 / ISO 48-4) | 60 | |
| Tensile strength (CQP036-1 / ISO 527) | 2.5 MPa | |
| 100 % modulus (CQP036-1 / ISO 527) | 1.3 MPa | |
| Elongation at break (CQP036-1 / ISO 527) | 400 % | |
| Tensile lap-shear strength (CQP046-1 / ISO 4587) | 1.9 MPa | |
| Thermal resistance (CQP 513-1) | 4 hours 1 hour | 200 °C 220 °C |
| Service temperature | -40 – 120 °C | |
| Shelf life | 9 months B |
| CQP = Corporate Quality Procedure | A) 23 °C / 50 % r. h. | B) stored below 25 °C |
CURE MECHANISM
Sikasil® AS-165 cures by reaction with atmospheric moisture. At low temperatures the water content of the air is generally lower and the curing reaction proceeds somewhat slower (see diagram 1).
Diagram 1: Curing speed Sikasil® AS-165
Application
Surface preparation
Surfaces must be clean, dry and free from grease, oil and dust. Surface treatment depends on the specific nature of the substrates and is crucial for a long lasting bond.
Application
The optimum temperature for substrate and sealant is between 15 °C and 25 °C.
Sikasil® AS-165 can be processed with manual, pneumatic or electric driven piston guns as well as pump equipment. For advice on selecting and setting up a suitable pump system, contact the System Engineering Department of Sika Industry.
Joints must be properly dimensioned.
Joints deeper than 15 mm must be avoided.
Tooling and finishing
Tooling and finishing must be carried out within the skin time of the sealant or adhesive. When tooling freshly applied Sikasil® AS-165 press the adhesive to the joint flanks to get a good wetting of the bonding surface. No tooling agents to be used.
Removal
Uncured Sikasil® AS-165 may be removed from tools and equipment with Sika® Remover-208 or another suitable solvent. Once cured, the material can only be removed mechanically.
Hands and exposed skin have to be washed immediately using hand wipes such as Sika® Cleaner-350H or a suitable industrial hand cleaner and water.
Do not use solvents on skin.
Overpainting
Sikasil® AS-165 cannot be overpainted.
Application limits
To exclude materials influencing Sikasil® AS-165, all adjacent materials in direct and indirect contact have to be tested.
Where two or more different reactive sealants are used, allow the first to cure completely before applying the next one.
Sikasil® AS-165 may only be used for serial application after a detailed examination and written approval of the corresponding project details by Sika Industry.