Sikaflex®-254 + SikaBooster® P-50
Sikaflex®-254 + SikaBooster® P-50 is an accelerated elastic polyurethane adhesive especially designed for bonding large components. Timber, aluminum, sheet steel, primers, paints, ceramics and plastics are suitable substrates. The use of SikaBooster® P-50 provides rapid attainment of strength and early adhesion development. Owing to the use of SikaBooster® it cures largely independently of atmospheric conditions.
- Fast-curing by Booster Technology
- Excellent adhesion build-up on various substrates
- Ideal open-time / curing-speed ratio
- Elastic, good gap-filling capabilities
- Capable of withstanding high dynamic stresses
- Solvent-free
PRODUCT BENEFITS
- Fast-curing by Booster Technology
- Excellent adhesion build-up on various substrates
- Ideal open-time / curing-speed ratio
- Elastic, good gap-filling capabilities
- Capable of withstanding high dynamic stresses
- Solvent-free
Areas of Application
Sikaflex®-254 + SikaBooster® P-50 is suitable for assemblies that are subject to dynamic stresses. Suitable substrate materials are timber, metals, particularly aluminum (including anodized components), sheet steel (including phosphated, chromated and galvanized components), metal primers and paint coatings (2-component systems), ceramic materials and plastics. Seek manufacturer’s advice and perform tests on original substrates before using Sikaflex®-254 + SikaBooster® P-50 on materials prone to stress cracking. This product is suitable for experienced professional users only. Test with actual substrates and conditions have to be performed ensuring adhesion and material compatibility.Product Details
| Chemical base | Polyurethane | |
| Color (CQP001-1) | Black, white | |
| Cure mechanism | Moisture-curing A | |
| Density (uncured) | depending on color SikaBooster® P-50 | 1.3 kg/l 1.1 kg/l |
| Booster content | by volume by weight | 2 % (1.8 ─ 2.2 %) 1.8 % (1.6 ─ 2.0 %) |
| Non-sag properties | Good | |
| Application temperature | ambient | 10 ─ 30 °C |
| Open time (CQP526-1) | 20 minutes B | |
| Early tensile lap-shear strength (CQP046-1 / ISO 4587) | See table 1 | |
| Shore A hardness (CQP023-1 / ISO 48-4) | 45 | |
| Tensile strength (CQP036-1 / ISO 527) | 3 MPa | |
| Elongation at break (CQP036-1 / ISO 527) | 400 % | |
| Tear propagation resistance (CQP045-1 / ISO 34) | 9 N/mm | |
| Tensile lap-shear strength (CQP046-1 / ISO 4587) | 2.2 MPa | |
| Service temperature (CQP513-1) |
4 hours 1 hour | -40 ─ 90 °C 130 °C 150 °C |
| Shelf life | Adhesive (pail / drum) SikaBooster® P-50 | 6 months C 9 months C |
| Mixer | Statomix MS13/18 G |
| CQP = Corporate Quality Procedure | A) provided by SikaBooster® P-50 | B) 23 °C / 50 % r. h. | C) storage below 25 °C |
CURE MECHANISM
Sikaflex®-254 + SikaBooster® P-50 cures by reaction with moisture provided by SikaBooster® P-50 and largely independent from atmospheric moisture. For typical strength build up data see table below.
| Time [h] | Tensile lap-shear strength at 23 °C [MPa] |
| 2 | 1 |
| 3 | 1.5 |
| 4 | 2 |
Table 1: Strength build up of Sikaflex®-254 + SikaBooster® P-50
CHEMICAL RESISTANCE
Sikaflex®-254 + SikaBooster® P-50 is generally resistant to fresh water, seawater, diluted acids and diluted caustic solutions; temporarily resistant to fuels, mineral oils, vegetable and animal fats and oils; not resistant to organic acids, glycolic alcohol, concentrated mineral acids and caustic solutions or solvents.
Application
Surface preparation
Surfaces must be clean, dry and free from grease, oil and dust. Surface treatment depends on the specific nature of the substrates and is crucial for a long lasting bond. All pre-treatment steps must be confirmed by preliminary tests on original substrates considering specific conditions in the assembly process.
Application
Sikaflex®-254 + SikaBooster® P-50 need to be processed with an adequate dispensing system. The mixer type needs to be respected (see table Typical Product Data).
Sikaflex®-254 + SikaBooster® P-50 can be applied between 10 °C and 30 °C but changes in reactivity and application properties have to be considered. The optimum temperature for substrate and sealant is between 15 °C and 25 °C. To ensure a uniform thickness of the bondline it is recommend to apply the adhesive in form of a triangular bead (see figure 1).
Figure 1: Recommended bead configuration
The open time is significantly shorter in hot and humid climate. The parts must always be joint within the open time. As a rule of thumb, a change of + 10 °C reduces the open time by half.
Sikaflex®-254 + SikaBooster® P-50 is processed with an adequate pump equipment. For advice on selecting and setting up a suitable pump system, contact the System Engineering Department of Sika Industry.
Removal
Uncured Sikaflex®-254 + SikaBooster® P-50 can be removed from tools and equipment with Sika® Remover-208 or another suitable solvent. Once cured, the material can only be removed mechanically. Hands and exposed skin have to be washed immediately using hand wipes such as Sika® Cleaner-350H or a suitable industrial hand cleaner and water. Do not use solvents on skin.