Sikasil® AS-75

Industrial multi-purpose silicone adhesive

Sikasil® AS-75 is a 1-component, non-corrosive silicone adhesive. It adheres well to a wide range of substrates. It is specially used for frame and junction box bonding in the photovoltaic industry.  

  • Very good adhesion to a wide variety of substrates
  • Good mechanical properties
  • Performance retention over a wide temperature range
  • Long-term durability
  • UL Certified: UL94 HB
 
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PRODUCT BENEFITS

  • Very good adhesion to a wide variety of substrates
  • Good mechanical properties
  • Performance retention over a wide temperature range
  • Long-term durability
  • UL Certified: UL94 HB
 

Areas of Application

Sikasil® AS-75 can be used for demanding industrial bonding and sealing applications. It is especially suited for frame and junction box bonding in the photovoltaic industry.
Common substrates are metals, particularly aluminum, glass, metal primers and paint coatings (2-C systems), ceramic materials, plastics and wood. This product is suitable for experienced professional users only. Tests with actual substrates and conditions have to be performed ensuring adhesion and material compatibility.  

Product Details

Typical Product Data
Chemical base

1-component silicone

Color (CQP001-1)

White

Cure mechanism

Moisture-curing

Cure type

Alkoxy

Density (uncured)

1.52 kg/l

Non-sag properties (CQP061-4 / ISO 7390)

Good

Application temperature

ambient

5 ─ 40 °C

Skin time (CQP019-1)

6 minutes A

Curing speed (CQP049-1)

(see diagram)

Shore A hardness (CQP023-1 / ISO 48-4)

62

Tensile strength (CQP036-1 / ISO 527)

2.0 MPa

100 % modulus (CQP036-1 / ISO 527)

1.5 MPa

Elongation at break (CQP036-1 / ISO 527)

170 %

Thermal resistance (CQP 513-1)

4 hours
1 hour

200 °C
220 °C

Service temperature

-40 ─ 120 °C

Shelf life

9 months B

CQP = Corporate Quality Procedure

A) 23 °C / 50 % r. h.

B) storage below 25 °C
Technical Information

CURE MECHANISM

Sikasil® AS-75 cures by reaction with atmospheric moisture. At low temperatures the water content of the air is generally lower and the curing reaction proceeds somewhat slower (see diagram 1).

en_PNG_01-diagram-sikasil_as-75

Diagram 1: Curing speed Sikasil® AS-75

Application

Application Information

Surface preparation

Surfaces must be clean, dry and free from grease, oil and dust. Surface treatment depends on the specific nature of the substrates and is crucial for a long lasting bond.

Application

The optimum temperature for substrate and sealant is between 15 °C and 25 °C.
Sikasil® AS-75 can be processed with manual, pneumatic or electric driven piston guns as well as pump equipment.

For advice on selecting and setting up a suitable pump system, contact the System Engineering Department of Sika Industry.
Joints must be properly dimensioned.

Joints deeper than 15 mm must be avoided.

 

Tooling and finishing

Tooling and finishing must be carried out within the skin time of the sealant.

When tooling freshly applied Sikasil® AS-75 press the sealant to the joint flanks to get a good wetting of the bonding surface. No tooling agents to be used.

Removal

Uncured Sikasil® AS-75 can be removed from tools and equipment with Sika® Remover-208 or another suitable solvent. Once cured, the material can only be removed mechanically.
Hands and exposed skin have to be washed immediately using hand wipes such as Sika® Cleaner-350H cleaning towels or a suitable industrial hand cleaner and water.

Do not use solvents on skin.

Overpainting

Sikasil® AS-75 cannot be overpainted.

Application limits

To exclude materials influencing Sikasil® AS-75, all adjacent materials in direct and indirect contact have to be tested. Where two or more different reactive sealants are used, allow the first to cure completely before applying the next.
Sikasil® AS-75 may only be used for serial application after a detailed examination and written approval of the corresponding project details by Sika Industry.